共 50 条
- [43] Thermal imaging method in the evaluation of obesity in various body regions - A preliminary study 3RD INTERNATIONAL CONFERENCE ON ADVANCES IN MECHANICAL ENGINEERING (ICAME 2020), PTS 1-6, 2020, 912
- [46] Validation of submodel technique for fracture evaluation in wafer-level package under thermal loading ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,
- [47] Research on Reliability Simulation Evaluation of Electronic Products Based on Thermal-vibration Combined Loading 2016 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE (PHM-CHENGDU), 2016,
- [48] Comprehensive Evaluation on Efficiency and Thermal Loading of Associated Si and SiC based PV Inverter Applications 39TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY (IECON 2013), 2013, : 555 - 560
- [49] J-INTEGRAL EVALUATION OF A CRACK IN THE PRESSURE-VESSEL UNDER THERMAL TRANSIENT LOADING BULLETIN OF THE JSME-JAPAN SOCIETY OF MECHANICAL ENGINEERS, 1985, 28 (245): : 2562 - 2566