USE OF SPUTTERED CONDUCTOR MATERIALS IN FILM INTEGRATED-CIRCUITS

被引：7
|
作者：
LAU, SS [1 ]
机构：
[1] BELL TEL LABS INC, ALLENTOWN, PA 18103 USA
来源：
THIN SOLID FILMS | 1972年 / 14卷 / 01期
关键词：
D O I：
10.1016/0040-6090(72)90372-0
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：87 / 103
页数：17
相关论文
共 50 条
  • [31] NEW INTEGRATED-CIRCUITS
    STEIN, KU
    SIEMENS FORSCHUNGS-UND ENTWICKLUNGSBERICHTE-SIEMENS RESEARCH AND DEVELOPMENT REPORTS, 1979, 8 (05): : 249 - 250
  • [32] ENCAPSULATING INTEGRATED-CIRCUITS
    WHITE, ML
    BELL LABORATORIES RECORD, 1974, 52 (03): : 78 - 83
  • [33] TELECOMMUNICATION INTEGRATED-CIRCUITS
    GOODENOUGH, F
    ELECTRONIC DESIGN, 1985, 33 (01) : 198 - &
  • [34] PHOTONIC INTEGRATED-CIRCUITS
    KOCH, TL
    KOREN, U
    AT&T TECHNICAL JOURNAL, 1992, 71 (01): : 63 - 74
  • [35] TINX THIN-FILM RESISTORS FOR HYBRID INTEGRATED-CIRCUITS
    KEMPISTY, Z
    KROLSTEPNIEWSKA, L
    POSADOWSKI, W
    ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1980, 6 (3-4): : 231 - 233
  • [36] SELECTIVE GOLD PLATING FOR THIN-FILM INTEGRATED-CIRCUITS
    SHIFLETT, CC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (08) : C357 - C357
  • [37] PHOTOELECTRONIC INTEGRATED-CIRCUITS
    IKEGAMI, T
    PHILOSOPHICAL TRANSACTIONS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 1989, 329 (1603): : 131 - 137
  • [38] MICROWAVE INTEGRATED-CIRCUITS
    OUVRARD, PL
    PARISOT, M
    GOURRIER, S
    ONDE ELECTRIQUE, 1993, 73 (06): : 32 - 40
  • [39] MERGED INTEGRATED-CIRCUITS
    MARSHALL, S
    SOLID STATE TECHNOLOGY, 1976, 19 (06) : 33 - 33
  • [40] COMPLEMENTARY TRANSISTOR TECHNOLOGY FOR USE IN OPTOELECTRONIC INTEGRATED-CIRCUITS
    KIELY, PA
    TAYLOR, GW
    DOCTER, DP
    EVALDSSON, PA
    VANG, TA
    TELL, B
    BROWNGOEBELER, KF
    IEE PROCEEDINGS-G CIRCUITS DEVICES AND SYSTEMS, 1993, 140 (04): : 279 - 284
12345