共 50 条
- [22] EFFECT OF ANNEALING TEMPERATURE ON SUBGRAIN GROWTH DURING RECOVERY IN OXYGEN-FREE HIGH CONDUCTIVITY COPPER MATERIALS SCIENCE AND ENGINEERING, 1988, 100 : L15 - L18
- [24] The role of orientation pinning in statically recrystallized oxygen-free high-conductivity copper wire METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2005, 36A (01): : 205 - 215
- [26] The role of orientation pinning in statically recrystallized oxygen-free high-conductivity copper wire Metallurgical and Materials Transactions A, 2005, 36 : 205 - 215
- [27] RELATIONSHIP BETWEEN WETTING OF MOLTEN COPPER ON CU2O AND ADHERENCE OF CU2O TO COPPER AMERICAN CERAMIC SOCIETY BULLETIN, 1967, 46 (04): : 369 - &
- [28] VACUUM BREAKDOWN VOLTAGES OF DISPERSION-STRENGTHENED COPPER VS OXYGEN-FREE, HIGH-CONDUCTIVITY COPPER JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1970, 7 (02): : 358 - &