共 50 条
- [31] THE EFFECTS OF COPPER UNDERLAYS ON THE STABILITY OF GOLD THIN-FILMS DURING ISOTHERMAL ANNEALING JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1989, 7 (03): : 1273 - 1278
- [32] THE EFFECTS OF TIN UNDERLAYS ON THE STABILITY OF GOLD THIN-FILMS DURING ISOTHERMAL ANNEALING PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1991, 124 (01): : 211 - 219
- [33] Fabrication and characterization of nickel-gold plateble LTCC substrates based on borosilicate glass/Al2O3 system 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 1649 - 1652
- [34] Fabrication of Nickel-Gold Microsensor Using In Situ Laser-Induced Metal Deposition Technique JOURNAL OF LASER MICRO NANOENGINEERING, 2019, 14 (03): : 266 - 269
- [35] LATTICE DISLOCATION BEHAVIOR IN BOUNDARIES OF GRAINS AND PHASES DURING ANNEALING OF NICKEL-ALLOY FIZIKA METALLOV I METALLOVEDENIE, 1987, 64 (02): : 383 - 389
- [37] Special Features of Growth of Intermetallic Phases during Annealing of Nickel-Aluminum Composites Metal Science and Heat Treatment, 2022, 63 : 660 - 666
- [38] THE DISSOLUTION OF CEMENTITE IN A LOW-CARBON STEEL DURING ISOTHERMAL ANNEALING AT 700-DEGREES-C METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1986, 17 (04): : 617 - 620