MULTICHIP MODULES

被引:0
|
作者
BRUCE, RH
MEULI, WP
HO, J
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:389 / 393
页数:5
相关论文
共 50 条
  • [21] HOW TO SPECIFY MULTICHIP MODULES
    GREEN, H
    ELECTRONIC PRODUCTS MAGAZINE, 1994, 36 (12): : 29 - 31
  • [22] CONTACTLESS TESTING OF MULTICHIP MODULES
    BRUNNER, M
    SCHMID, R
    SCHMITT, R
    STURM, M
    GESSNER, O
    MICROELECTRONIC ENGINEERING, 1994, 24 (1-4) : 61 - 70
  • [23] LAYER ASSIGNMENT FOR MULTICHIP MODULES
    HO, JM
    SARRAFZADEH, M
    VIJAYAN, G
    WONG, CK
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 1990, 9 (12) : 1272 - 1277
  • [24] LTCC microwave multichip modules
    Yan, Wei
    Hong, Wei
    Xue, Yu
    Tien Tzu Hsueh Pao/Acta Electronica Sinica, 2002, 30 (05): : 711 - 714
  • [25] Electrochemical migration in multichip modules
    Rudra, B.
    Li, M.J.
    Pecht, M.
    Jennings, D.
    Circuit World, 1995, 22 (01) : 67 - 70
  • [26] Many uses for multichip modules
    Normington, Pete
    Electronic Packaging and Production, 1995, 35 (06):
  • [27] Multichip modules for automotive applications
    Simsek, A
    Strohschein, W
    Reichl, H
    1999 INTERNATIONAL CONFERENCE ON HIGH DENSITY PACKAGING AND MCMS, PROCEEDINGS, 1999, 3830 : 58 - 63
  • [28] SUBSTRATE MATERIALS FOR MULTICHIP MODULES
    OMARA, WC
    ADVANCED MATERIALS & PROCESSES, 1989, 135 (02): : 44 - 44
  • [29] Company to build multichip modules
    不详
    MICROWAVES & RF, 1999, 38 (08) : 27 - 27
  • [30] The MCG autorouter for multichip modules
    Carothers, JD
    Li, DH
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-FUNDAMENTAL THEORY AND APPLICATIONS, 1999, 46 (05): : 572 - 578