TIN PLATING FROM THE PYROPHOSPHATE BATH

被引：19

作者：

VAID, J

CHAR, TLR

机构：

来源：

关键词：

D O I：

10.1149/1.2428562

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：282 / 287

页数：6

共 50 条

[21] ELECTROLESS COPPER PLATING FROM AN IMINODIACETATE BATH
OHNO, I
SURFACE TECHNOLOGY, 1976, 4 (06): : 515 - 520
[22] Bright zinc plating from chloride bath
Venkatesha, TV
BULLETIN OF ELECTROCHEMISTRY, 1996, 12 (7-8): : 472 - 476
[23] Electroless nickel plating from acid bath
Malecki, A
Micek-Ilnicka, A
SURFACE & COATINGS TECHNOLOGY, 2000, 123 (01): : 72 - 77
[24] Tin deposition from a gluconate bath
Vasantha, V.
Metal Finishing, 1995, 93 (10)
[25] COPPER PLATING FROM PYROPHOSPHATE ELECTROLYTES CONTAINING DEPOLARIZERS
GERENROT, YE
GOLDIN, LZ
SOVIET ELECTROCHEMISTRY, 1976, 12 (02): : 238 - 241
[26] PLATING BATH TROUBLES
MOHLER, JB
METAL FINISHING, 1985, 83 (06) : 39 - 42
[27] PULSE PLATING WITH A TRIVALENT CHROMIUM PLATING BATH
TU, ZM
YANG, ZO
ZHANG, JH
PLATING AND SURFACE FINISHING, 1990, 77 (10): : 55 - 57
[28] Deposition of copper on TiN from pyrophosphate solution
Long, JG
Radisic, A
Hoffmann, PM
Searson, PC
ELECTROCHEMICAL PROCESSING IN ULSI FABRICATION AND SEMICONDUCTOR/METAL DEPOSITION II, PROCEEDINGS, 1999, 99 (09): : 149 - 155
[29] Pulse co-deposition of tin-silver alloy from citric acid plating bath for microelectronic applications
Sharma, Ashutosh
Chung, Choong-Heui
Ahn, Byungmin
MATERIALS RESEARCH EXPRESS, 2019, 6 (11):
[30] ELECTROLESS NICKEL PLATING FROM A GLYCINE BATH.
Yajima, S.
Matsushita, S.
Togawa, Y.
Kanbe, T.
Metal Finishing, 1987, 85 (01): : 23 - 26