Low temperature joining of segmented tools for cut-off grinding by adhesive bonding technology

For machining of stone cut-off grinding wheels are used. At its circumference grinding segments made of carbide metal and diamond as grinding grains are applied which are connected by soldering or laser beam welding. These join technologies cause a couple of negative effects due to the high temperatures applied in the join process. In contrast adhesive bonding avoids these negative effects as it is a low temperature process. In this article the effect of different optimization steps of the geometry for adhesive bonding is illustrated and the development of a repair and maintenance tool for partly automated saw blade mounting with segments is shown. Thereafter the performance of the new tools was tested for cutting of granite and samples of different geometries were produced and tested in quasi static tensile tests for evaluation of compound strength.