Study of a Low-Temperature Bonding Process for a Next-Generation Flexible Display Module Using Transverse Ultrasound

被引：1
|
作者：
Ji, Myeong-Gu [1 ]
Song, Chun-Sam [2 ]
Kim, Joo-Hyun [3 ]
Kim, Jong-Hyeong [4 ]
机构：
[1] Seoul Natl Univ Sci & Technol, Sch NID Fus Nano Micro Robot Syst, Seoul, South Korea
[2] LTS, R&D Ctr Inc, Uiwang Si, South Korea
[3] Kookmin Univ, Sch Mech Engn, Seoul, South Korea
[4] Seoul Natl Univ Sci & Technol, Sch Mech Design & Automat Engn, Seoul, South Korea
来源：
TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A | 2012年 / 36卷 / 04期
关键词：
Ultrasonic Bonding; Low Temperature Bonding; Metal Bump Direct Bonding; FPCB; Display Module;
D O I：
10.3795/KSME-A.2012.36.4.395
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
This is direct bonding many of the metal bumps between FPCB and HPCB substrate. By using an ultrasonic horn mounted on an ultrasonic bonding machine, it is possible to bond gold pads onto the FPCB and HPCB at room temperature without an adhesive like ACA or NCA and high heat and solder. This ultrasonic bonding technology minimizes damage to the material. The process conditions evaluated for obtaining a greater bonding strength than 0.6 kgf, which is commercially required, were 40 kHz of frequency; 0.6MPa of bonding pressure; and 0.5, 1.0, 1.5, and 2.0 s of bonding time. The peel off test was performed for evaluating bonding strength, which was found to be more than 0.80 kgf.
引用
收藏
页码：395 / 403
页数：9
相关论文
共 50 条
  • [41] STUDY ON P4 PEAK IN LOW-TEMPERATURE COLD-HAMMERED GOLD USING MEASUREMENTS OF INTERIOR FRICTION AND OF MODULE ANOMALY
    MERCIER, O
    ISORE, A
    BENOIT, W
    HELVETICA PHYSICA ACTA, 1973, 46 (01): : 18 - 21
  • [42] Study of the adhesion and interface of the low-temperature bonding of vacuum ultraviolet-irradiated cyclo-olefin polymer using electron microscopy
    Horiuchi, Shin
    Hakukawa, Hideki
    Kim, Yong Jong
    Nagata, Hideya
    Sugimura, Hiroyuki
    POLYMER JOURNAL, 2016, 48 (04) : 473 - 479
  • [43] Study of the adhesion and interface of the low-temperature bonding of vacuum ultraviolet-irradiated cyclo-olefin polymer using electron microscopy
    Shin Horiuchi
    Hideki Hakukawa
    Yong Jong Kim
    Hideya Nagata
    Hiroyuki Sugimura
    Polymer Journal, 2016, 48 : 473 - 479
  • [44] Study of the petroleum schedules thermal cleaning process from asphalt, ressin and paraffin deposits using low-temperature plasma
    Samigullin, A. D.
    Galiakbarov, A. T.
    Galiakbarov, R. T.
    VII CONFERENCE ON LOW TEMPERATURE PLASMA IN THE PROCESSES OF FUNCTIONAL COATING PREPARATION, 2016, 669
  • [45] Low-temperature joining of semiconductor substrates and thin layers on solid and flexible wafers by solid-liquid inter-diffusion bonding using a low-thickness Ni-Sn system
    Zanetti, Martina
    Hamon, Gwenaelle
    Regregny, Philippe
    Leclercq, Jean-Louis
    Aimez, Vincet
    Darnon, Maxime
    Danescu, Alexandre
    2023 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS/MOEMS, DTIP, 2023,
  • [46] SOLUTION X-RAY-SCATTERING STUDY OF RECONSTITUTION PROCESS OF TOBACCO MOSAIC-VIRUS PARTICLE USING LOW-TEMPERATURE QUENCHING
    SANO, Y
    INOUE, H
    HIRAGI, Y
    URAKAWA, H
    KAJIWARA, K
    BIOPHYSICAL CHEMISTRY, 1995, 55 (03) : 239 - 245
  • [47] Study of critical free-area ratio during the snow-melting process on pavement using low-temperature heating fluids
    Wang, Huajun
    Chen, Zhihao
    ENERGY CONVERSION AND MANAGEMENT, 2009, 50 (01) : 157 - 165
  • [48] Next-Generation Sequencing Analysis of Pancreatic Cancer Using Residual Liquid Cytology Specimens from Endoscopic Ultrasound-Guided Fine-Needle Biopsy: A Prospective Comparative Study with Tissue Specimens
    Iwaya, Hiromichi
    Tanimoto, Akihide
    Toyodome, Koshiro
    Kojima, Issei
    Hinokuchi, Makoto
    Tanoue, Shiroh
    Hashimoto, Shinichi
    Kawahira, Machiko
    Arima, Shiho
    Kanmura, Shuji
    Akahane, Toshiaki
    Higashi, Michiyo
    Suzuki, Shinsuke
    Ueno, Shinichi
    Ohtsuka, Takao
    Ido, Akio
    DIAGNOSTICS, 2023, 13 (06)
  • [49] A study on low-temperature crystallization of SrBi2Ta2O9 thin films prepared by sol-gel method using steam curing process
    Sawada, Y
    Kobari, H
    Sato, Y
    Hashimoto, A
    Koiwa, I
    Kobayashi, H
    Osaka, T
    INTEGRATED FERROELECTRICS, 1999, 26 (1-4) : 889 - 897
  • [50] A Phase 1, Multicenter, Open-Label Study to Establish the Preliminary Tolerability, Efficacy, Pharmacokinetics, and Pharmacodynamics of CC-97540 (BMS-986353), a CD19-directed CAR T Cell Therapy Manufactured Using a Next-generation Process, for Severe, Refractory Autoimmune Diseases
    Schett, Georg
    Littlejohn, Emily
    Kramer, Neil
    Saxena, Amit
    Mease, Philip
    Wiesendanger, Margrit
    Mueller, Fabian
    Reshef, Ran
    Caimi, Paolo
    Cherry, Mohamad
    Hsu, Jingmei
    Patel, Krish
    Azzi, Jacques
    Falcon, Susana
    Ly, Thomas
    Ogasawara, Ken
    Das, Sharmila
    Thorpe, Jerill
    Maldonado, Michael
    Stifano, Giuseppina
    Koegel, Ashley
    Askanase, Anca
    ARTHRITIS & RHEUMATOLOGY, 2024, 76 : 3580 - 3582
12345