THERMAL-STRESS IN BONDED JOINTS

被引：201
|
作者：
CHEN, WT
NELSON, CW
机构：
来源：
IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1979年 / 23卷 / 02期
关键词：
D O I：
10.1147/rd.232.0179
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper considers the stress distributions in bonded materials induced by differential expansion or contraction of these materials. The analytical approach is similar to the lap joint theories attributed to Volkersen and expanded by Goland and Reissner. Several simple and typical analytical models are presented to bring out the relative importance of different geometrical and material parameters and to give some insight into different modes in which the bonds might fail.
引用
收藏
页码：179 / 188
页数：10
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