HIGH-SPEED PROCESSING PACKAGE FOR ARBOMATIK PROCESSOR

被引：0
|
作者：
不详
机构：
来源：
PULP AND PAPER MAGAZINE OF CANADA | 1972年 / 73卷 / 02期
关键词：
D O I：
暂无
中图分类号：
TB3 [工程材料学]; TS [轻工业、手工业、生活服务业];
学科分类号：
0805 ; 080502 ; 0822 ;
摘要：
引用
收藏
页码：81 / &
相关论文
共 50 条
  • [41] A HIGH-SPEED SMALL-SCALE SIGNAL PROCESSOR
    SCHLOSS, HJ
    BALLENBERGER, G
    SIGNAL PROCESSING, 1981, 3 (01) : 29 - 36
  • [42] PRECISION HIGH-SPEED RANGE SENSOR AND PROCESSOR.
    Corby Jr., N.R.
    Sensor Review, 1988, 8 (03) : 155 - 160
  • [43] Package Technology Evaluation and Optimization for High-Speed Applications
    Lo, Louis
    Cheah, Bok Eng
    2014 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2014, : 625 - 630
  • [44] Manufacturability and reliability of a high-speed CSPSRAM on an interposer package
    Liu, Kuo-Chuan
    Priest, Judy
    Xue, Jie
    Lin, Jarsh
    Kao, Chin-Li
    Wang, Tong Hong
    Lai, Yi-Shao
    58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 374 - +
  • [45] TRANSMISSION OF HIGH-SPEED ELECTRICAL SIGNALS IN A JOSEPHSON PACKAGE
    ANDERSON, CJ
    KLEIN, M
    KETCHEN, MB
    IEEE TRANSACTIONS ON MAGNETICS, 1983, 19 (03) : 1182 - 1185
  • [46] SiliconPipe announces high-speed interconnectivity with no package vias
    不详
    CONNECTOR SPECIFIER, 2005, 21 (11) : 4 - 9
  • [47] ELECTRICAL CHARACTERISTICS OF A SUPERCONDUCTING HIGH-SPEED COMPUTER PACKAGE
    BEHA, HA
    RAVER, N
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1985, 8 (03): : 374 - 385
  • [48] Laminate package trends for high-speed system interconnects
    Cases, M
    de Araujo, DN
    Pham, N
    Blackshear, E
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2003, : 147 - 150
  • [49] Optimization of High-Speed Package Design on Statistical Domain
    Kim, Il-Joon
    Lee, Manho
    Han, Ki Jin
    Kim, Gyoungbum
    Kim, Dae-Woo
    Oh, Dan
    2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 964 - 969
  • [50] Accurate measurement of high-speed package and interconnect parasitics
    Carlton, D.E., IEEE Components, Hybrids & Manufacturing Technology Soc, New; IEEE Tokyo Section, Tokyo, Jpn; IEEE CHMT, Tokyo Chapter, Tokyo, Jpn (Publ by IEEE, Piscataway, NJ, United States):
12345