COPPER-BASED METALLIZATION AND INTERCONNECTS FOR ULTRA-LARGE-SCALE INTEGRATION APPLICATIONS

被引：18
|
作者：
ALFORD, TL
LI, J
MAYER, JW
WANG, SQ
机构：
来源：
THIN SOLID FILMS | 1995年 / 262卷 / 1-2期
关键词：
D O I：
10.1016/0040-6090(95)06624-1
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：R7 / R8
页数：2
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