共 50 条
- [41] Progress of 3D integration technologies and 3D interconnects [J]. PROCEEDINGS OF THE IEEE 2007 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2007, : 213 - 215
- [42] Addressing Public Law Restrictions within a 3D Cadastral Context [J]. ISPRS INTERNATIONAL JOURNAL OF GEO-INFORMATION, 2017, 6 (07):
- [44] Materials for 3D Integration [J]. 2016 INTERNATIONAL SYMPOSIUM ON 3D POWER ELECTRONICS INTEGRATION AND MANUFACTURING (3D-PEIM), 2016,
- [46] 3D FOWLP Integration [J]. 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1728 - 1735
- [47] 3D silicon integration [J]. 58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 538 - +
- [48] FEASIBILITY OF 3D INTEGRATION [J]. EUROPEAN TRANSACTIONS ON TELECOMMUNICATIONS, 1990, 1 (02): : 137 - 142
- [50] 3D Device Integration [J]. 2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 427 - 430