HERMETIC GLASS SEALING BY ELECTROSTATIC BONDING

被引：18
|
作者：
YOUNGER, PR
机构：
来源：
JOURNAL OF NON-CRYSTALLINE SOLIDS | 1980年 / 38-9卷 / MAY-期
关键词：
D O I：
10.1016/0022-3093(80)90553-0
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：909 / 914
页数：6
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