STRUCTURE, PROPERTIES, AND THERMAL-STABILITY OF INSITU PHOSPHORUS-DOPED HYDROGENATED MICROCRYSTALLINE SILICON PREPARED BY PLASMA-ENHANCED CHEMICAL VAPOR-DEPOSITION

被引:6
|
作者
JENG, SJ
KOTECKI, DE
KANICKI, J
PARKS, CC
TIEN, J
机构
关键词
D O I
10.1063/1.105148
中图分类号
O59 [应用物理学];
学科分类号
摘要
The correlations between structural, chemical, electrical, optical properties of in situ phosphorus-doped hydrogenated microcrystalline silicon prepared by plasma-enhanced chemical vapor deposition have been studied by high-resolution transmission electron microscopy, secondary-ion mass spectrometry, electrical conductivity, and optical measurements. Microcrystallinity has been observed at a substrate temperature as low as 100-degrees-C with a 1% dilution of (1% PH3/SiH4) in H-2. In situ phosphorous-doped hydrogenated microcrystalline silicon is best grown at 200-300-degrees-C in terms of microstructure, H and P content, and dopant activation. The effects of thermal processing and the use of silicon nitride cap deposited prior to anneal on the structure and properties of phosphorous-doped hydrogenated microcrystalline silicon are also reported. The use of a silicon nitride capping layer is shown to inhibit recrystallization of hydrogenated microcrystalline silicon during rapid thermal anneal.
引用
收藏
页码:1632 / 1634
页数:3
相关论文
共 50 条
  • [41] Effect of GeF4 addition on the growth of hydrogenated microcrystalline silicon film by plasma-enhanced chemical vapor deposition
    Shirai, H
    Fukuda, Y
    Nakamura, T
    Azuma, K
    THIN SOLID FILMS, 1999, 350 (1-2) : 38 - 43
  • [42] Effect of GeF4 addition on the growth of hydrogenated microcrystalline silicon film by plasma-enhanced chemical vapor deposition
    Shirai, Hajime
    Fukuda, Yusuke
    Nakamura, Takuya
    Azuma, Kazuhumi
    Thin Solid Films, 1999, 350 (01): : 38 - 43
  • [43] High rate deposition of microcrystalline silicon using conventional plasma-enhanced chemical vapor deposition
    Guo, LH
    Kondo, M
    Fukawa, M
    Saitoh, K
    Matsuda, A
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1998, 37 (10A): : L1116 - L1118
  • [44] PLASMA-ENHANCED CHEMICAL VAPOR-DEPOSITION OF SILICON DIOXIDE USING TETRAETHYLORTHOSILICATE (TEOS)
    EMESH, IT
    DASTI, G
    MERCIER, JS
    LEUNG, P
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1989, 136 (11) : 3404 - 3408
  • [45] HEATING EFFECT IN PLASMA-ENHANCED CHEMICAL VAPOR-DEPOSITION OF SILICON-NITRIDE
    HAN, IK
    LEE, YJ
    JO, JH
    LEE, JI
    KANG, KN
    JOURNAL OF MATERIALS SCIENCE LETTERS, 1991, 10 (09) : 526 - 528
  • [46] The optical properties of silicon-rich silicon nitride prepared by plasma-enhanced chemical vapor deposition
    Yoshinaga, Seiya
    Ishikawa, Yasuaki
    Kawamura, Yusuke
    Nakai, Yuya
    Uraoka, Yukiharu
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 90 : 54 - 58
  • [47] STUDY OF THE CHEMICAL-COMPOSITION OF SILICON-NITRIDE FILMS OBTAINED BY CHEMICAL VAPOR-DEPOSITION AND PLASMA-ENHANCED CHEMICAL VAPOR-DEPOSITION
    OLIVERI, C
    BAROETTO, F
    MAGRO, C
    SURFACE & COATINGS TECHNOLOGY, 1991, 45 (1-3): : 137 - 146
  • [48] Substrate dependence of initial growth of microcrystalline silicon in plasma-enhanced chemical vapor deposition
    Kondo, M
    Toyoshima, Y
    Matsuda, A
    Ikuta, K
    JOURNAL OF APPLIED PHYSICS, 1996, 80 (10) : 6061 - 6063
  • [49] MICROHARDNESS AND OTHER PROPERTIES OF HYDROGENATED AMORPHOUS-SILICON CARBIDE THIN-FILMS FORMED BY PLASMA-ENHANCED CHEMICAL VAPOR-DEPOSITION
    BAYNE, MA
    KUROKAWA, Z
    OKORIE, NU
    ROE, BD
    JOHNSON, L
    MOSS, RW
    THIN SOLID FILMS, 1983, 107 (02) : 201 - 206
  • [50] PRODUCTION OF DISILANE AND SILYL STICKING COEFFICIENTS DURING PLASMA-ENHANCED CHEMICAL VAPOR-DEPOSITION OF HYDROGENATED AMORPHOUS-SILICON
    MCCAUGHEY, MJ
    KUSHNER, MJ
    APPLIED PHYSICS LETTERS, 1989, 54 (17) : 1642 - 1644