SOLDER JOINT MODELING USING FINITE-ELEMENT ANALYSIS

被引：0
|
作者：
LOVASCO, F
机构：
来源：
PROCEEDINGS OF THE TECHNICAL CONFERENCE : EIGHTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE | 1988年
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D O I：
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：410 / 415
页数：6
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