Finite-element analysis of solder joint strength in laser diode packaging

被引：1

作者：

Chang, CH ^{[1
]}

Sheen, MT ^{[1
]}

Kuang, JH ^{[1
]}

Chen, CC ^{[1
]}

Wang, GL ^{[1
]}

Cheng, WH ^{[1
]}

Chang, HL ^{[1
]}

Wang, SC ^{[1
]}

Wang, CY ^{[1
]}

Wang, CM ^{[1
]}

机构：

[1] Natl Sun Yat Sen Univ, Dept Mech Engn, Kaohsiung 804, Taiwan

来源：

OPTOELECTRONIC MATERIALS AND DEVICES II | 2000年 / 4078卷

关键词：

solder joint strength; PbSn solder; temperature cycling; finite-element method;

D O I：

10.1117/12.392199

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effect of PbSn solder joint strength on temperature tests in laser diode packaging has been studied experimentally and numerically. It was found that the solder joint strength increased as temperature cycle number increased. A finite-element method FEM analysis is performed on the calculation of joint strength of PbSn solder in temperature cycling tests for laser diode packaging. Numerical calculations were in good agreement with the experimental measurements that the solder joint strength increased as the temperature cycle increased. This is may be due to the redistribution of the residual stresses within the solder during temperature cycling tests, and hence reducing the residual stresses and increasing the solder joint strength as the temperature cycle number increased. The result suggests that the FEM is an effective method for predicting the solder joint strength in laser diode packages.

引用

页码：646 / 651

页数：6

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