ELECTRODEPOSITION OF COPPER IN THE PRESENCE OF CADMIUM

被引：18
|
作者：
BUDNIOK, A
GALA, J
PLUTA, I
机构：
来源：
ELECTROCHIMICA ACTA | 1979年 / 24卷 / 12期
关键词：
D O I：
10.1016/0013-4686(79)87080-2
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
引用
收藏
页码：1247 / 1252
页数：6
相关论文
共 50 条
  • [31] ELECTRODEPOSITION OF COPPER AND CADMIUM ON A SOLID ELECTRODE WITH FIXED HIGH DENSITY CURRENTS
    EMELIANENKO, GA
    BAIBAROVA, EJ
    DOKLADY AKADEMII NAUK SSSR, 1959, 129 (04): : 841 - 843
  • [32] Cadmium electrodeposition on copper substrate for cyclotron production of 111In radionuclide
    M. Mirzaii
    S. Seyyedi
    M. Sadeghi
    Z. Gholamzadeh
    Journal of Radioanalytical and Nuclear Chemistry, 2010, 284 : 333 - 339
  • [33] VARIATION OF RESISTIVITY OF COPPER-DOPED CADMIUM TELLURIDE PREPARED BY ELECTRODEPOSITION
    VONWINDHEIM, JA
    COCIVERA, M
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1990, 23 (05) : 581 - 586
  • [34] Cadmium electrodeposition on copper substrate for cyclotron production of 111In radionuclide
    Mirzaii, M.
    Seyyedi, S.
    Sadeghi, M.
    Gholamzadeh, Z.
    JOURNAL OF RADIOANALYTICAL AND NUCLEAR CHEMISTRY, 2010, 284 (02) : 333 - 339
  • [35] Simulation of shape evolution during electrodeposition of copper in the presence of additives
    Veyret, D
    Georgiadou, M
    Sani, RL
    Verhoff, M
    Alkire, RC
    FUNDAMENTAL ASPECTS OF ELECTROCHEMICAL DEPOSITION AND DISSOLUTION, PROCEEDINGS, 2000, 99 (33): : 405 - 412
  • [36] INITIAL-STAGES OF COPPER ELECTRODEPOSITION IN THE PRESENCE OF ORGANIC ADDITIVES
    MICHAILOVA, E
    VITANOVA, I
    STOYCHEV, D
    MILCHEV, A
    ELECTROCHIMICA ACTA, 1993, 38 (16) : 2455 - 2458
  • [37] Electrodeposition of copper on glassy carbon electrodes in the presence of picolinic acid
    Bolzan, A. E.
    ELECTROCHIMICA ACTA, 2013, 113 : 706 - 718
  • [38] Simulation of shape evolution during electrodeposition of copper in the presence of additive
    Georgiadou, M
    Veyret, D
    Sani, RL
    Alkire, RC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001, 148 (01) : C54 - C58
  • [39] Electrodeposition of Copper in the Presence of Aliphatic and Aromatic Diamines as Organic Additives
    Abdel-Rahman, H. H.
    Harfoush, A. A.
    Moustafa, A. H. E.
    ELECTROCHEMISTRY, 2012, 80 (04) : 226 - 238
  • [40] ELECTRODEPOSITION OF COPPER POWDER FROM COPPER SULPHATE SOLUTION IN PRESENCE OF GLYCEROL AND SULPHURIC ACID
    Viswanath, S. G.
    Jachak, M. M.
    METALLURGICAL & MATERIALS ENGINEERING, 2013, 19 (02) : 119 - 135
12345