共 50 条
- [1] Electromigration threshold in copper interconnects [J]. APPLIED PHYSICS LETTERS, 2001, 78 (23) : 3598 - 3600
- [4] Electromigration Characteristics for Electron Down-Flow in Copper Interconnects [J]. PROCESSES AT THE SEMICONDUCTOR-SOLUTION INTERFACE 4, 2011, 35 (08): : 211 - 221
- [5] Surface electromigration in copper interconnects [J]. 1999 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 37TH ANNUAL, 1999, : 270 - 276
- [8] Enhancing the electromigration resistance of copper interconnects [J]. PROCEEDINGS OF THE IEEE 2003 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2003, : 162 - 164
- [9] Optimizing the electromigration performance of copper interconnects [J]. INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, : 119 - 122
- [10] Modeling Electromigration Lifetimes of Copper Interconnects [J]. MICROELECTRONICS TECHNOLOGY AND DEVICES - SBMICRO 2011, 2011, 39 (01): : 163 - 169