PACKAGING FOR POWER ICS

被引:0
|
作者
HOPKINS, TL
机构
来源
ELECTRONIC PRODUCTS MAGAZINE | 1984年 / 26卷 / 14期
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:137 / 142
页数:6
相关论文
共 50 条
  • [41] PACKAGING TECHNOLOGY FOR MICROWAVE ICS AND HIGH-SPEED LOGIC
    NEVIN, L
    BELOHOUBEK, E
    GILBERT, BK
    KAELIN, G
    LONG, S
    RINNE, RK
    THORNE, R
    TSUKI, T
    ISSCC DIGEST OF TECHNICAL PAPERS, 1982, 25 : 218 - 219
  • [42] Numerical Prediction of Residual Stresses Evolving During Packaging of ICs
    Adli, A. R. Rezaie
    Jansen, K. M. B.
    Ernst, L. J.
    2015 16TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2015,
  • [43] Effects of Packaging on Mechanical Stress in 3D-ICs
    Cherman, V.
    Lofrano, M.
    Simons, V.
    Gonzalez, M.
    Van der Plas, G.
    De Vos, J.
    Wang, T.
    Daily, R.
    Salahouelhadj, A.
    Beyer, G.
    La Manna, A.
    De Wolf, I.
    Beyne, E.
    2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 354 - 361
  • [44] THE POWER OF PACKAGING
    KINTISH, L
    SOAP COSMETICS CHEMICAL SPECIALTIES, 1994, 70 (10): : 46 - &
  • [45] The power of packaging
    Wubbe, Eileen
    Nonwovens Industry, 2003, 34 (10): : 46 - 52
  • [46] Source list - Power management ICs
    不详
    ELECTRONIC PRODUCTS MAGAZINE, 2001, : 24 - 25
  • [47] SPEED/POWER CHART FOR DIGITAL ICS
    不详
    ELECTRONIC ENGINEER, 1970, 29 (06): : 58 - &
  • [48] Discrete power ICs for specific applications
    Brown, Derek
    Electronic Products (Garden City, New York), 2000, 43 (04):
  • [49] POWER ICS NEED HEAT SINKS
    LEA, LL
    CONTROL ENGINEERING, 1986, 33 (09) : 20 - 20
  • [50] Low power silicon RF ICs
    Knapp, H
    Böck, J
    Wurzer, M
    Aufinger, K
    IEEE/AFCEA EUROCOMM 2000, CONFERENCE RECORD: INFORMATION SYSTEMS FOR ENHANCED PUBLIC SAFETY AND SECURITY, 2000, : 404 - 407