ELECTRICAL CHARACTERIZATION OF PACKAGES FOR HIGH-SPEED INTEGRATED-CIRCUITS

被引：16

|

作者：

STANGHAN, CJ

MACDONALD, BM

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1985年 / 8卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1985.1136536

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：468 / 473

页数：6

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