ELECTRICAL CHARACTERIZATION OF PACKAGES FOR HIGH-SPEED INTEGRATED-CIRCUITS

被引：16
|
作者：
STANGHAN, CJ
MACDONALD, BM
机构：
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1985年 / 8卷 / 04期
关键词：
D O I：
10.1109/TCHMT.1985.1136536
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：468 / 473
页数：6
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