PRINTED WIRING BOARDS - PRESENT AND FUTURE USES

被引：0
|
作者：
CARANO, M
机构：
来源：
PLATING AND SURFACE FINISHING | 1990年 / 77卷 / 10期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：42 / 42
页数：1
相关论文
共 50 条
  • [31] Using radcure for printed wiring boards - past successes, current hurdles and future challenges
    Bradley, G.
    [J]. SURFACE COATINGS INTERNATIONAL, 2009, 92 (02): : 62 - 67
  • [32] Recycling system for printed wiring boards with mounted parts
    Yokoyama, S
    Ikuta, Y
    Iji, M
    [J]. FIRST INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DEGIGN AND INVERSE MANUFACTURING, PROCEEDINGS, 1999, : 814 - 817
  • [33] Integral Plugged Blind via in Printed Wiring Boards
    Bhat, Shriram N.
    Varghese, Jissy
    Achutananda, N.
    Sharma, S. Venkateshwara
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (06): : 1015 - 1020
  • [34] REPAIRABILITY OF PRINTED WIRING BOARDS CONTAINING MICROELECTRONIC DEVICES
    MATZINGER, JR
    [J]. SOLID STATE TECHNOLOGY, 1968, 11 (09) : 39 - +
  • [35] Recycling system for printed wiring boards with mounted parts
    Resources and Environment Protection, Research Lab
    [J]. NEC Res Dev, 2 (111-117):
  • [36] COMPUTER-AIDED DRILLING OF PRINTED WIRING BOARDS
    BLACKARD, WM
    SOMMERS, RA
    [J]. WESTERN ELECTRIC ENGINEER, 1971, 15 (02): : 37 - &
  • [37] Kinetic analysis of the thermal degradation of printed wiring boards
    Alex Luyima
    Lifeng Zhang
    Lucas Nana Wiredu Damoah
    [J]. JOM, 2011, 63 : 33 - 37
  • [38] LOW DIELECTRIC MATERIAL FOR MULTILAYER PRINTED WIRING BOARDS
    TAKAHASHI, A
    NAGAI, A
    MUKOH, A
    WAJIMA, M
    TSUKANISHI, K
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (04): : 1115 - 1120
  • [39] DESIGNING PRINTED WIRING BOARDS FOR ECONOMIC AND QUALITY PRODUCTION
    CAVASIN, J
    [J]. MACHINE DESIGN, 1969, 41 (02) : 133 - &
  • [40] STATE OF THE ART IN THE RECYCLING OF WASTE PRINTED WIRING BOARDS
    Zuo, Xiangjun
    Zhang, Lifeng
    [J]. RECYCLING OF ELECTRONIC WASTE II: PROCEEDINGS OF THE SECOND SYMPOSIUM, 2011, : 55 - 64
12345