EVALUATION METHODS FOR EXAMINATION OF THICK-FILM MATERIALS

被引：0
|
作者：
COLEMAN, MV [1 ]
机构：
[1] STANDARD TELECOMMUN LABS LTD,LONDON RD,HARLOW CMIT 9NA,ESSEX,ENGLAND
来源：
RADIO AND ELECTRONIC ENGINEER | 1975年 / 45卷 / 03期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：121 / 130
页数：10
相关论文
共 50 条
  • [1] THICK-FILM MATERIALS
    SETTY, MS
    [J]. ELECTRONICS INFORMATION & PLANNING, 1981, 8 (06): : 436 - 438
  • [2] THICK-FILM MATERIALS FOR HYBRIDS
    COLEMAN, M
    [J]. RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
  • [3] THICK-FILM MATERIALS AND RELIABILITY
    GRAVES, PW
    [J]. ELECTRICAL COMMUNICATION, 1982, 57 (02): : 127 - 131
  • [4] TRENDS IN THICK-FILM MATERIALS
    MONES, AH
    ROSENBERG, RM
    [J]. SOLID STATE TECHNOLOGY, 1976, 19 (10) : 47 - 49
  • [5] Evaluation of Thick-Film Materials for High-Temperature Packaging
    Zhou, Zhangming
    Cui, Jinzi
    Yu, Fang
    Johnson, R. Wayne
    Hamilton, Michael C.
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (05): : 773 - 783
  • [6] THICK-FILM TECHNOLOGY - AN INTRODUCTION TO THE MATERIALS
    LARRY, JR
    ROSENBERG, RM
    UHLER, RO
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (02): : 211 - 225
  • [7] MATERIALS SCIENCE OF THICK-FILM TECHNOLOGY
    VEST, RW
    [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1986, 65 (04): : 631 - 636
  • [8] AN OVERVIEW OF THICK-FILM HYBRID MATERIALS
    HOFFMAN, LC
    [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1984, 63 (04): : 572 - 576
  • [9] COPPER THICK-FILM MATERIALS - A PERSPECTIVE
    COX, JJ
    [J]. SOLID STATE TECHNOLOGY, 1980, 23 (10) : 150 - 152
  • [10] THICK-FILM CAPACITOR DIELECTRIC MATERIALS
    SAYERS, P
    [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1983, 62 (08): : 876 - 876
12345