HIGH-DENSITY MODULES SUIT MILITARY APPLICATIONS

被引：0
|
作者：
KRAUS, J [1 ]
机构：
[1] INTEGRATED DEVICE TECHNOL INC,SANTA CLARA,CA
来源：
DESIGN NEWS | 1983年 / 39卷 / 19期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
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页码：142 / &
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