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- [5] The Effect of Tellurium Presence in Anodic Copper on Kinetics and Mechanism of Anodic Dissolution and Cathodic Deposition of Copper [J]. INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2013, 8 (05): : 7274 - 7283
- [7] EFFECT OF As5 + AND Sb3 + IONS ON THE KINETICS AND MECHANISM OF ANODIC DISSOLUTION AND CATHODIC DEPOSITION OF COPPER. [J]. Erzmetall: Journal for Exploration, Mining and Metallurgy, 1987, 40 (11): : 593 - 597
- [8] ANODIC-DISSOLUTION AND CATHODIC DEPOSITION OF A CONDUCTING POLYMER [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1992, 204 : 77 - COLL
- [9] KINETICS AND MECHANISM OF THE ELECTROCHEMICAL OXIDATION OF IN+ IONS IN THE ANODIC-DISSOLUTION OF INDIUM [J]. SOVIET ELECTROCHEMISTRY, 1984, 20 (09): : 1066 - 1072
- [10] THE KINETICS AND MECHANISM OF THE ANODIC-DISSOLUTION OF PHOSPHORUS-CONTAINING COPPER IN BRIGHT COPPER PLATING ELECTROLYTES [J]. SURFACE TECHNOLOGY, 1981, 14 (04): : 309 - 321