The effect of nickel presence in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper

The influence of the presence of Ni atoms, as foreign metal atoms in anode copper, on kinetics, as foreign metal atoms in anode copper, and on the mechanism of anodic dissolution and cathodic deposition of copper in acidic sulfate system has been investigated. The galvanostatic single-pulse method has been used. Results indicate that presence of Ni atoms in anode copper, decreases the exchange current density as determined from the Tafel analysis of the electrode reaction. It is connected with the decrease of the crystal lattice parameter determined from XRD analysis of the electrode material. (C) 2001 The Electrochemical Society.