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ELECTRICAL AND THERMAL-STABILITY OF AUGENI OHMIC CONTACTS TO GAAS FABRICATED WITH INSITU RF SPUTTER CLEANING
被引:14
|
作者
:
CALLEGARI, A
论文数:
0
引用数:
0
h-index:
0
CALLEGARI, A
LACEY, D
论文数:
0
引用数:
0
h-index:
0
LACEY, D
PAN, ETS
论文数:
0
引用数:
0
h-index:
0
PAN, ETS
机构
:
来源
:
SOLID-STATE ELECTRONICS
|
1986年
/ 29卷
/ 05期
关键词
:
D O I
:
10.1016/0038-1101(86)90073-0
中图分类号
:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号
:
0808 ;
0809 ;
摘要
:
引用
收藏
页码:523 / 527
页数:5
相关论文
共 48 条
[1]
ELECTRICAL AND THERMAL-STABILITY OF AUGENI OHMIC CONTACTS ON GAAS FABRICATED WITH INSITU RF SPUTTER CLEANING
CALLEGARI, A
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
CALLEGARI, A
LACEY, D
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
LACEY, D
PAN, ETS
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
PAN, ETS
JOURNAL OF THE ELECTROCHEMICAL SOCIETY,
1985,
132
(06)
: C219
-
C219
[2]
STUDIES OF AUGENI OHMIC CONTACTS TO GAAS WITH INSITU RF SPUTTER CLEANING
CALLEGARI, A
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
CALLEGARI, A
MURAKAMI, M
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
MURAKAMI, M
BAKER, J
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
BAKER, J
SHIH, YC
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
SHIH, YC
LACEY, D
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
LACEY, D
JOURNAL OF ELECTRONIC MATERIALS,
1987,
16
(04)
: A19
-
A19
[3]
IMPROVEMENT OF OHMIC CONTACTS ON GAAS WITH INSITU CLEANING
REN, F
论文数:
0
引用数:
0
h-index:
0
REN, F
EMERSON, AB
论文数:
0
引用数:
0
h-index:
0
EMERSON, AB
PEARTON, SJ
论文数:
0
引用数:
0
h-index:
0
PEARTON, SJ
FULLOWAN, TR
论文数:
0
引用数:
0
h-index:
0
FULLOWAN, TR
BROWN, JM
论文数:
0
引用数:
0
h-index:
0
BROWN, JM
APPLIED PHYSICS LETTERS,
1991,
58
(10)
: 1030
-
1032
[4]
ON THE INFLUENCE OF SPUTTER ETCH CLEANING ON THE SILICIDATION, THE THERMAL-STABILITY AND THE ELECTRICAL CHARACTERISTICS OF TI/P-SI CONTACTS
VERCAEMST, AS
论文数:
0
引用数:
0
h-index:
0
机构:
IMEC,B-3000 HEVERLEE,BELGIUM
IMEC,B-3000 HEVERLEE,BELGIUM
VERCAEMST, AS
VANMEIRHAEGHE, RL
论文数:
0
引用数:
0
h-index:
0
机构:
IMEC,B-3000 HEVERLEE,BELGIUM
IMEC,B-3000 HEVERLEE,BELGIUM
VANMEIRHAEGHE, RL
LAFLERE, WH
论文数:
0
引用数:
0
h-index:
0
机构:
IMEC,B-3000 HEVERLEE,BELGIUM
IMEC,B-3000 HEVERLEE,BELGIUM
LAFLERE, WH
CARDON, F
论文数:
0
引用数:
0
h-index:
0
机构:
IMEC,B-3000 HEVERLEE,BELGIUM
IMEC,B-3000 HEVERLEE,BELGIUM
CARDON, F
DEBOSSCHER, W
论文数:
0
引用数:
0
h-index:
0
机构:
IMEC,B-3000 HEVERLEE,BELGIUM
IMEC,B-3000 HEVERLEE,BELGIUM
DEBOSSCHER, W
SCHREUTELKAMP, RJ
论文数:
0
引用数:
0
h-index:
0
机构:
IMEC,B-3000 HEVERLEE,BELGIUM
IMEC,B-3000 HEVERLEE,BELGIUM
SCHREUTELKAMP, RJ
SOLID-STATE ELECTRONICS,
1993,
36
(05)
: 753
-
759
[5]
ELECTRICAL CHARACTERISTICS AND THERMAL-STABILITY OF PLATINUM SILICIDE TO SILICON OHMIC CONTACTS METALIZED WITH TUNGSTEN
SINHA, AK
论文数:
0
引用数:
0
h-index:
0
机构:
BELL LABS,MURRAY HILL,NJ 07974
BELL LABS,MURRAY HILL,NJ 07974
SINHA, AK
JOURNAL OF THE ELECTROCHEMICAL SOCIETY,
1973,
120
(03)
: C90
-
&
[6]
THERMAL-STABILITY OF TUNGSTEN OHMIC CONTACTS TO THE GRADED-GAP INGAAS/GAAS/ALGAAS HETEROSTRUCTURE
LAHAV, A
论文数:
0
引用数:
0
h-index:
0
机构:
AT&T BELL LABS,MURRAY HILL,NJ 07974
AT&T BELL LABS,MURRAY HILL,NJ 07974
LAHAV, A
REN, F
论文数:
0
引用数:
0
h-index:
0
机构:
AT&T BELL LABS,MURRAY HILL,NJ 07974
AT&T BELL LABS,MURRAY HILL,NJ 07974
REN, F
KOPF, RF
论文数:
0
引用数:
0
h-index:
0
机构:
AT&T BELL LABS,MURRAY HILL,NJ 07974
AT&T BELL LABS,MURRAY HILL,NJ 07974
KOPF, RF
APPLIED PHYSICS LETTERS,
1989,
54
(17)
: 1693
-
1695
[7]
FABRICATION AND THERMAL-STABILITY OF W-SI OHMIC CONTACTS
KUMAR, V
论文数:
0
引用数:
0
h-index:
0
机构:
BELL TEL LABS INC,MURRAY HILL,NJ 07974
BELL TEL LABS INC,MURRAY HILL,NJ 07974
KUMAR, V
JOURNAL OF THE ELECTROCHEMICAL SOCIETY,
1976,
123
(02)
: 262
-
269
[8]
ELECTRICAL CHARACTERISTICS AND THERMAL-STABILITY OF PLATINUM SILICIDE-TO-SILICON OHMIC CONTACTS METALIZED WITH TUNGSTEN
SINHA, AK
论文数:
0
引用数:
0
h-index:
0
机构:
BELL LABS INC, MURRAY HILL, NJ 07974 USA
BELL LABS INC, MURRAY HILL, NJ 07974 USA
SINHA, AK
JOURNAL OF THE ELECTROCHEMICAL SOCIETY,
1973,
120
(12)
: 1767
-
1771
[9]
THERMAL-STABILITY OF OHMIC CONTACTS TO N-GAAS FORMED BY SCANNED ELECTRON-BEAM PROCESSING
PRASAD, K
论文数:
0
引用数:
0
h-index:
0
PRASAD, K
FARAONE, L
论文数:
0
引用数:
0
h-index:
0
FARAONE, L
NASSIBIAN, AG
论文数:
0
引用数:
0
h-index:
0
NASSIBIAN, AG
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,
1990,
8
(04):
: 618
-
624
[10]
THERMAL-STABILITY OF TI/PT/AU NONALLOYED OHMIC CONTACTS ON INN
REN, F
论文数:
0
引用数:
0
h-index:
0
机构:
ATandT Bell Laboratories, Murray Hill
REN, F
ABERNATHY, CR
论文数:
0
引用数:
0
h-index:
0
机构:
ATandT Bell Laboratories, Murray Hill
ABERNATHY, CR
PEARTON, SJ
论文数:
0
引用数:
0
h-index:
0
机构:
ATandT Bell Laboratories, Murray Hill
PEARTON, SJ
WISK, PW
论文数:
0
引用数:
0
h-index:
0
机构:
ATandT Bell Laboratories, Murray Hill
WISK, PW
APPLIED PHYSICS LETTERS,
1994,
64
(12)
: 1508
-
1510
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