RESEARCH INTO FORMATION OF BONDS BETWEEN ALUMINIUM AND COPPER IN A HIGH VACUUM

被引：0
|
作者：
VERKIN, BI
KRAVCHEN.EL
LYULICHE.AN
机构：
来源：
AUTOMATIC WELDING USSR | 1966年 / 19卷 / 02期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：10 / &
相关论文
共 50 条
  • [41] The surface tension of liquid aluminium in high vacuum: The role of surface condition
    Molina, J. M.
    Voytovych, R.
    Louis, E.
    Eustathopoulos, N.
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2007, 27 (05) : 394 - 401
  • [42] ELECTRICAL PROPERTIES OF TIG WELDED JOINTS BETWEEN COPPER AND ALUMINIUM
    VOROPAI, NM
    ARTAMONO.NM
    AUTOMATIC WELDING USSR, 1966, 19 (10): : 63 - &
  • [43] Bonding between aluminium and copper in cold spraying: story of asymmetry
    Hussain, T.
    McCartney, D. G.
    Shipway, P. H.
    MATERIALS SCIENCE AND TECHNOLOGY, 2012, 28 (12) : 1371 - 1378
  • [44] SPECIAL FEATURES OF STRUCTURE OF FUSION WELDS BETWEEN ALUMINIUM AND COPPER
    LOZOVSKA.LV
    AUTOMATIC WELDING USSR, 1967, 20 (09): : 45 - &
  • [45] Formation and fracture of adhesive bonds between colloidal spheres
    Stainton, C
    Liang, W
    Kendall, K
    ENGINEERING FRACTURE MECHANICS, 1998, 61 (01) : 83 - 91
  • [46] MECHANISM OF FORMATION OF ADHESIONAL BONDS BETWEEN INCOMPATIBLE ELASTOMERS
    GINZBURG, LV
    SONNINSKAYA, SV
    DERKACHEVA, YS
    VYSOKOMOLEKULYARNYE SOEDINENIYA SERIYA B, 1991, 33 (08): : 637 - 638
  • [47] Formation and disruption of bonds between caregivers and institutionalized children
    Bartschi Gabatz, Ruth Irmgard
    Schwartz, Eda
    Milbrath, Viviane Marten
    Wander de Carvalho, Hudson Cristiano
    Lange, Celmira
    Soares, Marilu Correa
    REVISTA BRASILEIRA DE ENFERMAGEM, 2018, 71 : 2650 - 2658
  • [48] CORRELATION BETWEEN MOISTURE AND HF FORMATION IN THE ALUMINIUM PROCESS
    Sommerseth, Camilla
    Osen, Karen Sende
    Aarhaug, Thor Anders
    Skybakmoen, Egil
    Solheim, Asbjorn
    Rosenkilde, Christian
    Ratvik, Arne Petter
    LIGHT METALS 2011, 2011, : 339 - 344
  • [49] High temperature oxidation mechanism of dilute copper aluminium alloys
    Plascencia, G
    Utigard, TA
    CORROSION SCIENCE, 2005, 47 (05) : 1149 - 1163
  • [50] ELECTRON DAMAGE IN ALUMINIUM AND COPPER IN A HIGH VOLTAGE ELECTRON MICROSCOPE
    SHIRAISHI, K
    HISHINUM.A
    KATANO, Y
    TAOKA, T
    JERNKONTORETS ANNALER, 1971, 155 (08): : 521 - +
12345