BRIDGING THE GAP BETWEEN DESIGN AND TEST

被引：0
|
作者：
KUZEL, GL
BONNENBERG, H
机构：
来源：
MICROELECTRONICS AND RELIABILITY | 1989年 / 29卷 / 03期
关键词：
D O I：
10.1016/0026-2714(89)90622-7
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：365 / 370
页数：6
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