DETERMINATION OF TEMPERATURE OF INTEGRATED CIRCUIT CHIPS IN HYBRID PACKAGING

被引：0
|
作者：
YU, EY [1 ]
机构：
[1] BELL TEL LABS INC,MURRAY HILL,NJ 07974
来源：
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1976年 / 12卷 / 02期
关键词：
D O I：
10.1109/TPHP.1976.1135117
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：139 / 146
页数：8
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