EVIDENCE FOR ROOM-TEMPERATURE TUNNELING RECOMBINATION IN AMORPHOUS-SILICON

被引:4
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作者
DERSCH, H
AMER, NM
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10.1016/0022-3093(85)90733-1
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TQ174 [陶瓷工业]; TB3 [工程材料学];
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0805 ; 080502 ;
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页码:615 / 618
页数:4
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