High reliability electron-ejection method for high density flash memories

被引:5
|
作者
Kawahara, T
Miyamoto, N
Saeki, S
Jyouno, Y
Kato, M
Kimura, K
机构
[1] HITACHI DEVICE ENGN CO LTD, MOBARA, CHIBA 297, JAPAN
[2] HITACHI LTD, SEMICOND & INTEGRATED CIRCUITS DIV, KODAIRA, TOKYO 187, JAPAN
关键词
D O I
10.1109/4.482206
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
To minimize the electrical stress for electron-ejection of each flash memory cell, the variable word-line voltage (VVP) method and the variable pulse width VVP (VVWP) method are proposed. Both methods make it possible to achieve high reliability while maintaining the total operating time of the conventional method, and both provide a sufficient disturb margin, Simulation results show that both methods reduce the maximum Fowler-Nordheim tunnel current density by 1.4 orders of magnitude compared to that of the conventional method, and the VVWP method increases the number of verifications by much less than the VVP method, This is expected to triple the charge-to-breakdown (Q(bd)) by decreasing the trap generation, A Q(bd) higher than the injection charge is obtained, as needed for high density flash memories.
引用
收藏
页码:1554 / 1562
页数:9
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