THE DESIGN AND PERFORMANCE OF SUPERCOMPONENTS - HIGH-DENSITY MIC MODULES

被引：0
|
作者：
TSAI, W
GRAY, R
GRAZIANO, A
机构：
来源：
MICROWAVE JOURNAL | 1983年 / 26卷 / 11期
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：81 / &
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