SPECIAL SECTION ON HIGH-SPEED AND HIGH-DENSITY MULTIFUNCTIONAL LSI MEMORIES - FOREWORD

被引：0
|
作者：
MASUOKA, F
机构：
来源：
IEICE TRANSACTIONS ON ELECTRONICS | 1994年 / E77C卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：1249 / 1250
页数：2
相关论文
共 50 条
  • [21] SPECIAL ISSUE ON SIMULATION, MODELING, AND ELECTRICAL DESIGN OF HIGH-SPEED AND HIGH-DENSITY INTERCONNECTS - INTRODUCTION
    DAI, WWM
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-FUNDAMENTAL THEORY AND APPLICATIONS, 1992, 39 (11): : 857 - 860
  • [22] The Electrical Design of High-speed and High-density ASIC Package
    Tao, Wenjun
    Li, Jun
    Zhou, Yunyan
    Wang, Qidong
    Cao, Liqiang
    Guidotti, Daniel
    Wan, Lixi
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 497 - 499
  • [23] HIGH-DENSITY PACKAGING TECHNIQUE FOR HIGH-SPEED MILITARY COMPUTERS
    TOLLEY, GE
    TIPTON, RW
    IEEE SPECTRUM, 1965, 2 (03) : 82 - &
  • [24] DESIGN OF HIGH-SPEED, HIGH-DENSITY CNNS IN CMOS TECHNOLOGY
    CRUZ, JM
    CHUA, LO
    INTERNATIONAL JOURNAL OF CIRCUIT THEORY AND APPLICATIONS, 1992, 20 (05) : 555 - 572
  • [25] Quilt packaging: High-density, high-speed interchip communications
    Bernstein, Gary H.
    Liu, Qing
    Yan, Minjun
    Sun, Zhuowen
    Kopp, David
    Porod, Wolfgang
    Snider, Greg
    Fay, Patrick
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (04): : 731 - 740
  • [26] HIGH-SPEED AND HIGH-DENSITY STATIC INDUCTION TRANSISTOR MEMORY
    NISHIZAWA, JI
    TAMAMUSHI, T
    MOCHIDA, Y
    NONAKA, T
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1978, 13 (05) : 622 - 634
  • [27] DESIGNS MEET NEEDS OF HIGH-SPEED, HIGH-DENSITY SYSTEMS
    ORMOND, T
    EDN, 1990, 35 (14) : 50 - &
  • [28] HIGH-DENSITY MASK ROM WITH HIGH-SPEED PAGE MODE
    HOTTA, Y
    KURA, S
    OKADA, M
    TSUGITA, H
    SHARP TECHNICAL JOURNAL, 1993, (57): : 69 - 70
  • [29] Special Section on Recent Progress in Electrical Modeling and Simulation of High-Speed ICs and Packages Foreword
    Jiao, Dan
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2010, 33 (04): : 758 - 759
  • [30] HIGH-SPEED BIPOLAR LOGIC LSI
    SUDO, T
    NAKASHIMA, T
    YOSHII, A
    REVIEW OF THE ELECTRICAL COMMUNICATIONS LABORATORIES, 1979, 27 (1-2): : 55 - 71
12345