SOLID-STATE TRANSFORMATIONS DURING DIFFUSION BONDING OF COPPER TO IRON

被引:20
|
作者
CALVO, FA
URENA, A
DESALAZAR, JMG
MOLLEDA, F
CRIADO, AJ
机构
[1] Univ of Madrid, Spain, Univ of Madrid, Spain
关键词
D O I
10.1007/BF01154583
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
16
引用
收藏
页码:1231 / 1236
页数:6
相关论文
共 50 条
  • [1] Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication
    de Prado, Javier
    Børresen, Børre Tore
    Utrilla, Victoria
    Ureña, Alejandro
    [J]. Materials, 2024, 17 (21)
  • [2] Effect of argon ion bombardment on the solid-state diffusion bonding of copper
    Khan, TI
    Ohashi, O
    [J]. SCRIPTA MATERIALIA, 1998, 38 (10) : 1525 - 1532
  • [3] MODELING SOLID-STATE DIFFUSION BONDING
    HILL, A
    WALLACH, ER
    [J]. ACTA METALLURGICA, 1989, 37 (09): : 2425 - 2437
  • [4] Modelling solid-state diffusion bonding
    [J]. Hill, A., 1600, (37):
  • [5] Dynamic simulation of solid-state diffusion bonding
    Wu, G. Q.
    Li, Z. F.
    Luo, G. X.
    Li, H. Y.
    Huang, Z.
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 452 (529-535): : 529 - 535
  • [6] SOLID-STATE BONDING OF IRON WUSTITE ALUMINA
    SAKATA, K
    HONMA, K
    OGAWA, K
    WATANABE, O
    NII, K
    [J]. JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1985, 49 (07) : 540 - 546
  • [7] SOLID-STATE TRANSFORMATIONS IN COPPER-BASED ALLOYS
    MASSALSKI, TB
    [J]. METALS TECHNOLOGY, 1980, 7 (JUL): : 300 - 304
  • [9] Strength of Solid-state Silver Bonding between Copper
    Chen, Yi-Ling
    Lee, Chin C.
    [J]. 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1773 - 1776
  • [10] LOW-TEMPERATURE SOLID-STATE BONDING OF COPPER
    NICHTING, RA
    OLSON, DL
    EDWARDS, GR
    [J]. JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 1992, 1 (01) : 35 - 44