共 50 条
- [5] Dynamic simulation of solid-state diffusion bonding [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 452 (529-535): : 529 - 535
- [7] SOLID-STATE TRANSFORMATIONS IN COPPER-BASED ALLOYS [J]. METALS TECHNOLOGY, 1980, 7 (JUL): : 300 - 304
- [9] Strength of Solid-state Silver Bonding between Copper [J]. 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1773 - 1776