Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication

被引：0
|
作者：
de Prado, Javier [1 ]
Børresen, Børre Tore [2 ]
Utrilla, Victoria [1 ,3 ]
Ureña, Alejandro [1 ,3 ]
机构：
[1] Materials Science and Engineering Area, Escuela Superior de Ciencias Experimentales y Tecnología (ESCET), Rey Juan Carlos University, C/Tulipán s/n, Madrid, Móstoles,28933, Spain
[2] Research Centre, EQUINOR ASA, Arkitekt Ebbellsvei 10, Trondheim,7053, Norway
[3] Instituto de Investigación de Tecnologías para la Sostenibilidad, Universidad Rey Juan Carlos, C/Tulipán s/n, Madrid, Móstoles,28933, Spain
来源：
Materials | 2024年 / 17卷 / 21期
关键词：
Compendex;
D O I：
10.3390/ma17215333
中图分类号：
学科分类号：
摘要：
Chemical cleaning - Chemical polishing - Copper alloys - Diffusion bonding - Electrochemical etching - Intercalation - Surface cleaning - Surface reactions - Thermal diffusion in solids
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