共 50 条
- [42] On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), 2004, : 66 - 69
- [43] Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints 2008 EMAP CONFERENCE PROCEEDINGS, 2008, : 236 - 238
- [45] Lead-free solder materials: experimental enthalpies of mixing in the Ag-Cu-Sn and Cu-Ni-Sn ternary systems ZEITSCHRIFT FUR METALLKUNDE, 2004, 95 (03): : 151 - 163
- [48] Mechanical and microstructural analyses of three layered Cu-Ni-Zn/Cu-Zr/Cu-Ni-Zn clad material processed by High Pressure torsioning (HPT) ADVANCED MATERIALS AND PROCESSES II, PTS 1-3, 2012, 557-559 : 1161 - 1165
- [49] SPINODAL CU-NI-SN ALLOYS FOR ELECTRONIC APPLICATIONS JOURNAL OF METALS, 1984, 36 (11): : 52 - 54
- [50] DEFORMATION STUDIES ON CU-NI-SN SPINODAL ALLOYS PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1985, 91 (01): : 63 - 72