SUBMICRON METROLOGY IN THE SEMICONDUCTOR INDUSTRY

被引：3
|
作者：
CORLE, TR
机构：
[1] Prometrix Corporation, Santa Clara, CA 95054, 3255 Scott Blvd
来源：
SOLID-STATE ELECTRONICS | 1992年 / 35卷 / 03期
关键词：
D O I：
10.1016/0038-1101(92)90243-6
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Techniques used to measure critical dimensions and overlay misregistration on integrated circuits during manufacturing are reviewed. The current needs for accuracy and reproducibility of these measurements in the semiconductor industry are discussed. The measurement capabilities of three types of instruments: electrical testers, scanning electron microscopes and sectioning optical microscopes are compared. Measurements made on sectioning optical microscopes are emphasized because of their ability to independently image different focus levels when making critical dimension measurements. A comparison of overlay measurements made with an electrical tester and a sectioning optical microscope is also presented.
引用
收藏
页码：391 / 402
页数：12
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