THERMAL CONDUCTION MODULE - A HIGH-PERFORMANCE MULTILAYER CERAMIC PACKAGE

被引：112
|
作者：
BLODGETT, AJ
BARBOUR, DR
机构：
来源：
IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1982年 / 26卷 / 01期
关键词：
D O I：
10.1147/rd.261.0030
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：30 / 36
页数：7
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