THERMAL AND STRESS-ANALYSIS OF SEMICONDUCTOR WAFERS IN A RAPID THERMAL-PROCESSING OVEN

被引：126

|

作者：

LORD, HA

机构：

来源：

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 1988年 / 1卷 / 03期

关键词：

D O I：

10.1109/66.4383

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

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页码：105 / 114

页数：10

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