DRY ETCHING OF SILICON MATERIALS IN SF6 BASED PLASMAS - ROLES OF N2O AND O-2 GAS ADDITIVES

被引:28
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作者
TZENG, Y
LIN, TH
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D O I
10.1149/1.2100875
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
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页码:2304 / 2309
页数:6
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