TESTING, FAULT TOLERANCE EMERGE AS TOP ISSUES AT WAFER-SCALE CONFERENCE

被引：0

作者：

BEEDIE, M

机构：

来源：

ELECTRONIC DESIGN | 1985年 / 33卷 / 16期

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中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：63 / 64

页数：2

共 30 条

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