ALLOY HARDENING OF CU-SI SOLID SOLUTION AT 4.2 DEGREES K

被引：0
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作者：
KAMADA, K
机构：
来源：
JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN | 1966年 / 21卷 / 02期
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D O I：
10.1143/JPSJ.21.406
中图分类号：
O4 [物理学];
学科分类号：
0702 ;
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页码：406 / &
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