INFLUENCE OF THE BONDING CONDITIONS ON THE RESPONSE OF CAPACITIVE PRESSURE SENSORS

被引：7

作者：

CHAUFFLEUR, X ^{[1
]}

BLASQUEZ, G ^{[1
]}

PONS, P ^{[1
]}

机构：

[1] CNRS,LAAS,F-31077 TOULOUSE,FRANCE

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1995年 / 46卷 / 1-3期

关键词：

BONDING CONDITIONS; CAPACITIVE SENSORS; PRESSURE SENSORS;

D O I：

10.1016/0924-4247(94)00873-G

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The behaviour of a capacitive pressure sensor built from a deformable silicon plate bonded to a Pyrex 7740 substrate has been simulated numerically with finite-element calculations. The comparison of 3D simulations with experimental data has shown the validity of the numerical model used for the simulations. By carrying out st structural analysis with these tools, it has also been revealed that silicon and Pyrex exhibit substantial deformations in the neighbourhood of their bonding when a pressure is applied on the sensor. If these deformations did not occur, the sensitivity of the sensor would be divided by 2.1, its measurement range would be multiplied by 1.68 and its linearity would be significantly increased. It is inferred that the response of most pressure sensors is influenced by the deformations of the diaphragm bonding.

引用

页码：121 / 124

页数：4

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