A BALL FORMING PROCESS FOR THE ALUMINUM BALL BONDING OF SEMICONDUCTOR-DEVICE

被引：0
|
作者：
MIYAKE, H
KOKURA, S
SUWA, M
ONUKI, J
OKIKAWA, S
机构：
来源：
DENKI KAGAKU | 1985年 / 53卷 / 10期
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中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
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页码：824 / 827
页数：4
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