SPECIAL ISSUE ON 1ST EUROPEAN SOLID-STATE CIRCUITS CONFERENCE (ESSCIRC) - FOREWORD

被引：0

|

作者：

STEIN, KU

DEMAN, HJ

机构：

[1] SIEMENS AG,RES LABS,MUNICH,FED REP GER

[2] KATHOLIEKE UNIV LEUVEN,LEUVEN,BELGIUM

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1976年 / 11卷 / 03期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

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页码：351 / 351

页数：1

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