MCM - THE HIGH-PERFORMANCE ELECTRONIC PACKAGING TECHNOLOGY

被引：0
|
作者：
MUKUND, PR [1 ]
MCDONALD, JF [1 ]
机构：
[1] RENSSELAER POLYTECH INST,DEPT ELECT COMP & SYST ENGN,TROY,NY 12181
来源：
COMPUTER | 1993年 / 26卷 / 04期
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：10 / 12
页数：3
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