ROOM-TEMPERATURE TENSILE PROPERTIES OF SN-5-PERCENT-SB SOLDER

被引：17
|
作者：
MAHIDHARA, RK
SASTRY, SML
JERINA, KL
TURLIK, I
MURTY, KL
机构：
[1] WASHINGTON UNIV,MAT RES LAB,ST LOUIS,MO 63130
[2] MICROELECTR CTR N CAROLINA,RES TRIANGLE PK,NC 27709
[3] N CAROLINA STATE UNIV,RALEIGH,NC 27695
来源：
JOURNAL OF MATERIALS SCIENCE LETTERS | 1994年 / 13卷 / 19期
关键词：
D O I：
10.1007/BF00405039
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
[No abstract available]
引用
收藏
页码：1387 / 1389
页数：3
相关论文
共 50 条
  • [1] DEFORMATION AND FRACTURE-BEHAVIOR OF SN-5-PERCENT-SB SOLDER
    MAHIDHARA, RK
    SASTRY, SML
    TURLIK, I
    MURTY, KL
    SCRIPTA METALLURGICA ET MATERIALIA, 1994, 31 (09): : 1145 - 1150
  • [2] Room-temperature indentation creep of lead-free Sn-5%Sb solder alloy
    Geranmayeh, AR
    Mahmudi, R
    JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (07) : 1002 - 1009
  • [3] Room-temperature indentation creep of lead-free Sn-5%Sb solder alloy
    A. R. Geranmayeh
    R. Mahmudi
    Journal of Electronic Materials, 2005, 34 : 1002 - 1009
  • [4] Tensile and creep behavior of Sn-5%Sb solder
    Mahidhara, RK
    Markle, PC
    Murty, KL
    Turlik, I
    MICROSTRUCTURES AND MECHANICAL PROPERTIES OF AGING MATERIALS II, 1996, : 111 - 120
  • [5] Effect of content of Sn on spreading properties and tensile properties of Bi5Sb solder alloy
    Sheng, Yangyang
    Yan, Yanfu
    Tang, Kun
    Zhao, Kuaile
    Hanjie Xuebao/Transactions of the China Welding Institution, 2011, 32 (06): : 85 - 88
  • [6] Investigation of stress exponent in the room-temperature creep of Sn-40Pb-2.5Sb solder alloy
    Mahmudi, R.
    Rezaee-Bazzaz, A.
    Banaie-Fard, H. R.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2007, 429 (1-2) : 192 - 197
  • [7] Investigation of stress exponent in the room-temperature creep of Sn-40Pb-2.5Sb solder alloy
    School of Metallurgical and Materials Engineering, Faculty of Engineering, University of Tehran, Tehran, Iran
    Journal of Alloys and Compounds, 1600, 429 (1-2): : 192 - 197
  • [8] ROOM-TEMPERATURE AGING PROPERTIES OF SOME SOLDER ALLOYS
    LAMPE, BT
    WELDING JOURNAL, 1976, 55 (10) : S330 - S340
  • [9] Creep and mechanical properties of SN-5%SB solder
    Mahidhara, RK
    Murty, KL
    Haggag, FM
    DESIGN & RELIABILITY OF SOLDERS AND SOLDER INTERCONNECTIONS, 1997, : 75 - 83
  • [10] Influence of Cr inclusion on the microstructural evolutions and tensile properties of Sn-5 wt% Sb solder alloy
    Mousa, M. M.
    El-Rehim, A. F. Abd
    Abdelaziz, Shereen M.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2024, 35 (28)
12345