Effect of content of Sn on spreading properties and tensile properties of Bi5Sb solder alloy

被引：0
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作者：
Sheng, Yangyang [1 ]
Yan, Yanfu [1 ]
Tang, Kun [1 ]
Zhao, Kuaile [1 ]
机构：
[1] Henan University of Science and Technology, Luoyang 471003, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2011年 / 32卷 / 06期
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页码：85 / 88
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