STUDIES OF CORROSIVE OUTGASSES FROM VIA HOLES USING THERMAL-DESORPTION SPECTROSCOPY

被引:2
|
作者
TOKITOH, S [1 ]
UCHIDA, H [1 ]
UCHIDA, H [1 ]
OKUNO, Y [1 ]
LIU, GL [1 ]
SAKAYA, Y [1 ]
HIRASHITA, N [1 ]
机构
[1] OKI ELECT IND CO LTD,CTR PROC TECHNOL,HACHIOJI,TOKYO 193,JAPAN
关键词
THERMAL DESORPTION SPECTROSCOPY; CORROSIVE OUTGASSING; VIA HOLE; SPIN-ON-GLASS; AMMONIA DESORPTION; OCCLUSION OF AMMONIA;
D O I
10.1143/JJAP.34.1021
中图分类号
O59 [应用物理学];
学科分类号
摘要
This work reveals the presence of corrosive outgassing from via holes in multiinterdielectric structures with inorganic spin-on-glass (SOG) films using thermal desorption spectroscopy. Main species of the corrosive outgassing are found to be H2O, NH3 and HF. The amount of NH3 desorption reaches 5-10% of water desorption. Significant amounts of H2O and NH3 are found to be desorbed from the SOG films. The desorption of NH3 results from occlusion of the species into the SOG film through the via holes.
引用
收藏
页码:1021 / 1025
页数:5
相关论文
共 50 条